IDC, W Series, 陶瓷电容器

结果:
117
Manufacturer
Series
Capacitance
Voltage - Rated
Temperature Coefficient
Size / Dimension
Package / Case
Operating Temperature
Tolerance
Thickness (Max)
Applications
Height - Seated (Max)
Lead Spacing
Mounting Type
Ratings
Features
Failure Rate
Lead Style
结果117
搜索条目:
IDC, W
选择
图片产品详情单价可用性ECAD 模型Height - Seated (Max)ToleranceOperating TemperatureRatingsCapacitanceVoltage - RatedTemperature CoefficientPackage / CaseSize / DimensionMounting TypeApplicationsLead StyleFailure RateSeriesFeaturesThickness (Max)Lead Spacing
W3L14C155MAT1A
CAP CER 1.5UF 4V X7R 0612
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±20%
-55°C ~ 125°C
-
1.5 µF
4V
X7R
0612 (1632 Metric)
0.063" L x 0.126" W (1.60mm x 3.20mm)
Surface Mount, MLCC
Bypass, Decoupling
-
-
IDC, W
Low ESL (Multi-Terminal)
0.037" (0.95mm)
-
W2L1ZD105MAT1A
CAP CER 1UF 10V X5R 0508
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±20%
-55°C ~ 85°C
-
1 µF
10V
X5R
0508 (1220 Metric)
0.050" L x 0.080" W (1.27mm x 2.03mm)
Surface Mount, MLCC
Bypass, Decoupling
-
-
IDC, W
Low ESL (Multi-Terminal)
0.037" (0.95mm)
-
W3L1ZC105MAT1A
CAP CER 1UF 10V X7R 0612
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±20%
-55°C ~ 125°C
-
1 µF
10V
X7R
0612 (1632 Metric)
0.063" L x 0.126" W (1.60mm x 3.20mm)
Surface Mount, MLCC
Bypass, Decoupling
-
-
IDC, W
Low ESL (Multi-Terminal)
0.037" (0.95mm)
-
W2L14D225MAT1A
CAP CER 2.2UF 4V X5R 0508
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±20%
-55°C ~ 85°C
-
2.2 µF
4V
X5R
0508 (1220 Metric)
0.050" L x 0.080" W (1.27mm x 2.03mm)
Surface Mount, MLCC
Bypass, Decoupling
-
-
IDC, W
Low ESL (Multi-Terminal)
0.037" (0.95mm)
-
W2L16C105MAT1A
CAP CER 1UF 6.3V X7R 0508
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±20%
-55°C ~ 125°C
-
1 µF
6.3V
X7R
0508 (1220 Metric)
0.050" L x 0.080" W (1.27mm x 2.03mm)
Surface Mount, MLCC
Bypass, Decoupling
-
-
IDC, W
Low ESL (Multi-Terminal)
0.037" (0.95mm)
-
W3L1YD474MAT1A
CAP CER 0.47UF 16V X5R 0612
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±20%
-55°C ~ 85°C
-
0.47 µF
16V
X5R
0612 (1632 Metric)
0.063" L x 0.126" W (1.60mm x 3.20mm)
Surface Mount, MLCC
Bypass, Decoupling
-
-
IDC, W
Low ESL (Multi-Terminal)
0.037" (0.95mm)
-
W2L16C684KAT3S
CAP CER 0.68UF 6.3V X7R 0508
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±10%
-55°C ~ 125°C
-
0.68 µF
6.3V
X7R
0508 (1220 Metric)
0.050" L x 0.080" W (1.27mm x 2.03mm)
Surface Mount, MLCC
Bypass, Decoupling
-
-
IDC, W
Low ESL (Multi-Terminal)
0.022" (0.55mm)
-
W2L1ZC104MAT1S
CAP CER 0.1UF 10V X7R 0508
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±20%
-55°C ~ 125°C
-
0.1 µF
10V
X7R
0508 (1220 Metric)
0.050" L x 0.080" W (1.27mm x 2.03mm)
Surface Mount, MLCC
Bypass, Decoupling
-
-
IDC, W
Low ESL (Multi-Terminal)
0.022" (0.55mm)
-
W2L14Z474MAT1S
CAP IDC 0.47UF 4V X7S 0508
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±20%
-55°C ~ 125°C
-
0.47 µF
4V
X7S
0508 (1220 Metric)
0.050" L x 0.080" W (1.27mm x 2.03mm)
Surface Mount, MLCC
Bypass, Decoupling
-
-
IDC, W
Low ESL (Multi-Terminal)
0.022" (0.55mm)
-
W3L14C105MAT1S
CAP CER 1UF 4V X7R 0612
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±20%
-55°C ~ 125°C
-
1 µF
4V
X7R
0612 (1632 Metric)
0.063" L x 0.126" W (1.60mm x 3.20mm)
Surface Mount, MLCC
Bypass, Decoupling
-
-
IDC, W
Low ESL (Multi-Terminal)
0.022" (0.55mm)
-
W3L1ZC684MAT1A
CAP CER 0.68UF 10V X7R 0612
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±20%
-55°C ~ 125°C
-
0.68 µF
10V
X7R
0612 (1632 Metric)
0.063" L x 0.126" W (1.60mm x 3.20mm)
Surface Mount, MLCC
Bypass, Decoupling
-
-
IDC, W
Low ESL (Multi-Terminal)
0.037" (0.95mm)
-
W3L1ZD225MAT1A
CAP CER 2.2UF 10V X5R 0612
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±20%
-55°C ~ 85°C
-
2.2 µF
10V
X5R
0612 (1632 Metric)
0.063" L x 0.126" W (1.60mm x 3.20mm)
Surface Mount, MLCC
Bypass, Decoupling
-
-
IDC, W
Low ESL (Multi-Terminal)
0.037" (0.95mm)
-
W2L1YC104KAT1A
CAP CER 0.1UF 16V X7R 0508
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±10%
-55°C ~ 125°C
-
0.1 µF
16V
X7R
0508 (1220 Metric)
0.050" L x 0.080" W (1.27mm x 2.03mm)
Surface Mount, MLCC
Bypass, Decoupling
-
-
IDC, W
Low ESL (Multi-Terminal)
0.037" (0.95mm)
-
W2L16C684MAT1A
CAP CER 0.68UF 6.3V X7R 0508
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±20%
-55°C ~ 125°C
-
0.68 µF
6.3V
X7R
0508 (1220 Metric)
0.050" L x 0.080" W (1.27mm x 2.03mm)
Surface Mount, MLCC
Bypass, Decoupling
-
-
IDC, W
Low ESL (Multi-Terminal)
0.037" (0.95mm)
-
W2L16C684KAT1A
CAP CER 0.68UF 6.3V X7R 0508
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±10%
-55°C ~ 125°C
-
0.68 µF
6.3V
X7R
0508 (1220 Metric)
0.050" L x 0.080" W (1.27mm x 2.03mm)
Surface Mount, MLCC
Bypass, Decoupling
-
-
IDC, W
Low ESL (Multi-Terminal)
0.037" (0.95mm)
-
W2L1ZD105KAT1A
CAP CER 1UF 10V X5R 0508
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±10%
-55°C ~ 85°C
-
1 µF
10V
X5R
0508 (1220 Metric)
0.050" L x 0.080" W (1.27mm x 2.03mm)
Surface Mount, MLCC
Bypass, Decoupling
-
-
IDC, W
Low ESL (Multi-Terminal)
0.037" (0.95mm)
-
W2L1ZC683KAT1S
CAP CER 0.068UF 10V X7R 0508
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±10%
-55°C ~ 125°C
-
0.068 µF
10V
X7R
0508 (1220 Metric)
0.050" L x 0.080" W (1.27mm x 2.03mm)
Surface Mount, MLCC
Bypass, Decoupling
-
-
IDC, W
Low ESL (Multi-Terminal)
0.022" (0.55mm)
-
W2L1ZC474KAT1A
CAP CER 0.47UF 10V X7R 0508
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±10%
-55°C ~ 125°C
-
0.47 µF
10V
X7R
0508 (1220 Metric)
0.050" L x 0.080" W (1.27mm x 2.03mm)
Surface Mount, MLCC
Bypass, Decoupling
-
-
IDC, W
Low ESL (Multi-Terminal)
0.037" (0.95mm)
-
W2L16D105MAT1A
CAP CER 1UF 6.3V X5R 0508
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±20%
-55°C ~ 85°C
-
1 µF
6.3V
X5R
0508 (1220 Metric)
0.050" L x 0.080" W (1.27mm x 2.03mm)
Surface Mount, MLCC
Bypass, Decoupling
-
-
IDC, W
Low ESL (Multi-Terminal)
0.037" (0.95mm)
-
W3L1ZC684KAT1A
CAP CER 0.68UF 10V X7R 0612
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±10%
-55°C ~ 125°C
-
0.68 µF
10V
X7R
0612 (1632 Metric)
0.063" L x 0.126" W (1.60mm x 3.20mm)
Surface Mount, MLCC
Bypass, Decoupling
-
-
IDC, W
Low ESL (Multi-Terminal)
0.037" (0.95mm)
-

关于  陶瓷电容器

电容器是必不可少的被动电子元件,具有存储电荷的能力。其中陶瓷电容器是利用陶瓷材料作为介质、金属层作为非极化电极构建而成。 陶瓷电容器在各种应用中得到广泛使用,包括汽车电子、旁路、解耦、滤波、射频(RF)电路和静电放电(ESD)保护等。它们因其小巧的尺寸、高电容值和在广泛频率范围内的优异性能而备受赞赏。 陶瓷电容器的插入式版本通常采用圆盘形或“块状”形状,并配有两根导线引脚,便于插入电路板。这种形式因方便焊接和牢固的机械连接而受到青睐。 陶瓷电容器具有许多优点,包括高可靠性、低成本以及在不同环境条件下的稳定性。这些电容器中使用的介质材料决定了其温度系数和电压特性。制造商通常会提供数据手册,指定电容值、电压等级、公差和其他重要参数,以帮助正确选择和应用。 总之,陶瓷电容器在电子领域被广泛用于汽车应用、信号滤波和ESD保护等各种用途。它们由陶瓷和金属交替层构成,插入式版本具有圆盘形或块状形状,并配有两根导线引脚,便于集成到电路板中。这些电容器表现出优异的性能、小巧的尺寸和可靠性,因此在电子设计中备受青睐。