GoldMax 300 Comm X8L HT150C Series, 陶瓷电容器

结果:
187
Manufacturer
Series
Capacitance
Height - Seated (Max)
Tolerance
Lead Style
Lead Spacing
Voltage - Rated
Size / Dimension
Operating Temperature
Applications
Temperature Coefficient
Mounting Type
Ratings
Package / Case
Thickness (Max)
Features
Failure Rate
结果187
搜索条目:
GoldMax 300 Comm X8L HT150C
选择
图片产品详情单价可用性ECAD 模型Mounting TypeHeight - Seated (Max)ToleranceApplicationsPackage / CaseOperating TemperatureRatingsVoltage - RatedCapacitanceFeaturesFailure RateSeriesTemperature CoefficientSize / DimensionThickness (Max)Lead SpacingLead Style
C322C125J5N5TA
CAP CER RAD 1.2F 50V X8L 5%
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Through Hole
0.260" (6.60mm)
±5%
General Purpose
Radial
-55°C ~ 150°C
-
50V
1.2 µF
High Temperature
-
GoldMax 300 Comm X8L HT150C
X8L
0.200" L x 0.125" W (5.08mm x 3.18mm)
-
0.200" (5.08mm)
Formed Leads
C328C155M5N5TA
CAP CER RAD 1.5F 50V X8L
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Through Hole
0.300" (7.62mm)
±20%
General Purpose
Radial
-55°C ~ 150°C
-
50V
1.5 µF
High Temperature
-
GoldMax 300 Comm X8L HT150C
X8L
0.200" L x 0.125" W (5.08mm x 3.18mm)
-
0.200" (5.08mm)
Formed Leads
C328C125J5N5TA
CAP CER RAD 1.2F 50V X8L 5%
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Through Hole
0.300" (7.62mm)
±5%
General Purpose
Radial
-55°C ~ 150°C
-
50V
1.2 µF
High Temperature
-
GoldMax 300 Comm X8L HT150C
X8L
0.200" L x 0.125" W (5.08mm x 3.18mm)
-
0.200" (5.08mm)
Formed Leads
C326C155J5N5TA
CAP CER RAD 1.5F 50V X8L 5%
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Through Hole
0.300" (7.62mm)
±5%
General Purpose
Radial
-55°C ~ 150°C
-
50V
1.5 µF
High Temperature
-
GoldMax 300 Comm X8L HT150C
X8L
0.200" L x 0.125" W (5.08mm x 3.18mm)
-
0.100" (2.54mm)
Formed Leads - Kinked
C326C185J5N5TA7301
CAP CER RAD 1.8F 50V X8L 5%
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Through Hole
0.300" (7.62mm)
±5%
General Purpose
Radial
-55°C ~ 150°C
-
50V
1.8 µF
High Temperature
-
GoldMax 300 Comm X8L HT150C
X8L
0.200" L x 0.125" W (5.08mm x 3.18mm)
-
0.100" (2.54mm)
Formed Leads - Kinked
C320C185J5N5TATR
CAP CER RAD 1.8F 50V X8L 5%
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Through Hole
0.290" (7.36mm)
±5%
General Purpose
Radial
-55°C ~ 150°C
-
50V
1.8 µF
High Temperature
-
GoldMax 300 Comm X8L HT150C
X8L
0.200" L x 0.125" W (5.08mm x 3.18mm)
-
0.100" (2.54mm)
Straight
C323C225K5N5TATR
CAP CER RAD 2.2F 50V X8L 10%
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Through Hole
0.300" (7.62mm)
±10%
General Purpose
Radial
-55°C ~ 150°C
-
50V
2.2 µF
High Temperature
-
GoldMax 300 Comm X8L HT150C
X8L
0.200" L x 0.125" W (5.08mm x 3.18mm)
-
0.200" (5.08mm)
Formed Leads
C326C225K5N5TA7301
CAP CER RAD 2.2F 50V X8L 10%
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Through Hole
0.300" (7.62mm)
±10%
General Purpose
Radial
-55°C ~ 150°C
-
50V
2.2 µF
High Temperature
-
GoldMax 300 Comm X8L HT150C
X8L
0.200" L x 0.125" W (5.08mm x 3.18mm)
-
0.100" (2.54mm)
Formed Leads - Kinked
C320C185J5N5TA7301
CAP CER RAD 1.8F 50V X8L 5%
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Through Hole
0.290" (7.36mm)
±5%
General Purpose
Radial
-55°C ~ 150°C
-
50V
1.8 µF
High Temperature
-
GoldMax 300 Comm X8L HT150C
X8L
0.200" L x 0.125" W (5.08mm x 3.18mm)
-
0.100" (2.54mm)
Straight
C323C225M5N5TATR
CAP CER RAD 2.2F 50V X8L 20%
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Through Hole
0.300" (7.62mm)
±20%
General Purpose
Radial
-55°C ~ 150°C
-
50V
2.2 µF
High Temperature
-
GoldMax 300 Comm X8L HT150C
X8L
0.200" L x 0.125" W (5.08mm x 3.18mm)
-
0.200" (5.08mm)
Formed Leads
C322C225K5N5TA7301
CAP CER RAD 2.2F 50V X8L 10%
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Through Hole
0.260" (6.60mm)
±10%
General Purpose
Radial
-55°C ~ 150°C
-
50V
2.2 µF
High Temperature
-
GoldMax 300 Comm X8L HT150C
X8L
0.200" L x 0.125" W (5.08mm x 3.18mm)
-
0.200" (5.08mm)
Formed Leads
C326C125J5N5TA
CAP CER RAD 1.2F 50V X8L 5%
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Through Hole
0.300" (7.62mm)
±5%
General Purpose
Radial
-55°C ~ 150°C
-
50V
1.2 µF
High Temperature
-
GoldMax 300 Comm X8L HT150C
X8L
0.200" L x 0.125" W (5.08mm x 3.18mm)
-
0.100" (2.54mm)
Formed Leads - Kinked
C326C155M5N5TA
CAP CER RAD 1.5F 50V X8L 20%
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Through Hole
0.300" (7.62mm)
±20%
General Purpose
Radial
-55°C ~ 150°C
-
50V
1.5 µF
High Temperature
-
GoldMax 300 Comm X8L HT150C
X8L
0.200" L x 0.125" W (5.08mm x 3.18mm)
-
0.100" (2.54mm)
Formed Leads - Kinked
C320C155J5N5TA
CAP CER RAD 1.5F 50V X8L 5%
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Through Hole
0.290" (7.36mm)
±5%
General Purpose
Radial
-55°C ~ 150°C
-
50V
1.5 µF
High Temperature
-
GoldMax 300 Comm X8L HT150C
X8L
0.200" L x 0.125" W (5.08mm x 3.18mm)
-
0.100" (2.54mm)
Straight
C328C155K5N5TA
CAP CER RAD 1.5F 50V X8L 10%
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Through Hole
0.300" (7.62mm)
±10%
General Purpose
Radial
-55°C ~ 150°C
-
50V
1.5 µF
High Temperature
-
GoldMax 300 Comm X8L HT150C
X8L
0.200" L x 0.125" W (5.08mm x 3.18mm)
-
0.200" (5.08mm)
Formed Leads
C328C225K5N5TA7301
CAP CER RAD 2.2F 50V X8L 10%
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Through Hole
0.300" (7.62mm)
±10%
General Purpose
Radial
-55°C ~ 150°C
-
50V
2.2 µF
High Temperature
-
GoldMax 300 Comm X8L HT150C
X8L
0.200" L x 0.125" W (5.08mm x 3.18mm)
-
0.200" (5.08mm)
Formed Leads
C323C225K5N5TA7301
CAP CER RAD 2.2F 50V X8L 10%
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Through Hole
0.300" (7.62mm)
±10%
General Purpose
Radial
-55°C ~ 150°C
-
50V
2.2 µF
High Temperature
-
GoldMax 300 Comm X8L HT150C
X8L
0.200" L x 0.125" W (5.08mm x 3.18mm)
-
0.200" (5.08mm)
Formed Leads
C322C185J5N5TATR
CAP CER RAD 1.8F 50V X8L 5%
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Through Hole
0.260" (6.60mm)
±5%
General Purpose
Radial
-55°C ~ 150°C
-
50V
1.8 µF
High Temperature
-
GoldMax 300 Comm X8L HT150C
X8L
0.200" L x 0.125" W (5.08mm x 3.18mm)
-
0.200" (5.08mm)
Formed Leads
C328C225M5N5TATR
CAP CER RAD 2.2F 50V X8L
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Through Hole
0.300" (7.62mm)
±20%
General Purpose
Radial
-55°C ~ 150°C
-
50V
2.2 µF
High Temperature
-
GoldMax 300 Comm X8L HT150C
X8L
0.200" L x 0.125" W (5.08mm x 3.18mm)
-
0.200" (5.08mm)
Formed Leads
C322C225M5N5TATR
CAP CER RAD 2.2F 50V X8L 20%
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Through Hole
0.260" (6.60mm)
±20%
General Purpose
Radial
-55°C ~ 150°C
-
50V
2.2 µF
High Temperature
-
GoldMax 300 Comm X8L HT150C
X8L
0.200" L x 0.125" W (5.08mm x 3.18mm)
-
0.200" (5.08mm)
Formed Leads

关于  陶瓷电容器

电容器是必不可少的被动电子元件,具有存储电荷的能力。其中陶瓷电容器是利用陶瓷材料作为介质、金属层作为非极化电极构建而成。 陶瓷电容器在各种应用中得到广泛使用,包括汽车电子、旁路、解耦、滤波、射频(RF)电路和静电放电(ESD)保护等。它们因其小巧的尺寸、高电容值和在广泛频率范围内的优异性能而备受赞赏。 陶瓷电容器的插入式版本通常采用圆盘形或“块状”形状,并配有两根导线引脚,便于插入电路板。这种形式因方便焊接和牢固的机械连接而受到青睐。 陶瓷电容器具有许多优点,包括高可靠性、低成本以及在不同环境条件下的稳定性。这些电容器中使用的介质材料决定了其温度系数和电压特性。制造商通常会提供数据手册,指定电容值、电压等级、公差和其他重要参数,以帮助正确选择和应用。 总之,陶瓷电容器在电子领域被广泛用于汽车应用、信号滤波和ESD保护等各种用途。它们由陶瓷和金属交替层构成,插入式版本具有圆盘形或块状形状,并配有两根导线引脚,便于集成到电路板中。这些电容器表现出优异的性能、小巧的尺寸和可靠性,因此在电子设计中备受青睐。