GoldMax 300 Comm X7R Series, 陶瓷电容器

结果:
1,245
Manufacturer
Series
Capacitance
Height - Seated (Max)
Size / Dimension
Voltage - Rated
Lead Spacing
Tolerance
Thickness (Max)
Lead Style
Applications
Operating Temperature
Temperature Coefficient
Mounting Type
Ratings
Package / Case
Failure Rate
Features
结果1,245
搜索条目:
GoldMax 300 Comm X7R
选择
图片产品详情单价可用性ECAD 模型FeaturesMounting TypeHeight - Seated (Max)ToleranceCapacitanceOperating TemperaturePackage / CaseRatingsVoltage - RatedTemperature CoefficientApplicationsFailure RateSeriesSize / DimensionThickness (Max)Lead SpacingLead Style
C322C104M5R5CA7305
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数量
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PCB Symbol, Footprint & 3D Model
-
Through Hole
0.260" (6.60mm)
±20%
0.1 µF
-55°C ~ 125°C
Radial
-
50V
X7R
Bypass, Decoupling
-
GoldMax 300 Comm X7R
0.200" L x 0.125" W (5.08mm x 3.18mm)
-
0.200" (5.08mm)
Formed Leads
C330C684K5R5CA7303
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
Through Hole
0.360" (9.14mm)
±10%
0.68 µF
-55°C ~ 125°C
Radial
-
50V
X7R
Bypass, Decoupling
-
GoldMax 300 Comm X7R
0.280" L x 0.160" W (7.11mm x 4.07mm)
-
0.200" (5.08mm)
Formed Leads
C333C104K1R5CA7317
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
Through Hole
0.400" (10.16mm)
±10%
0.1 µF
-55°C ~ 125°C
Radial
-
100V
X7R
Bypass, Decoupling
-
GoldMax 300 Comm X7R
0.280" L x 0.160" W (7.11mm x 4.07mm)
-
0.200" (5.08mm)
Formed Leads - Kinked
C333C104K1R5CA7301
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
Through Hole
0.400" (10.16mm)
±10%
0.1 µF
-55°C ~ 125°C
Radial
-
100V
X7R
Bypass, Decoupling
-
GoldMax 300 Comm X7R
0.280" L x 0.160" W (7.11mm x 4.07mm)
-
0.200" (5.08mm)
Formed Leads - Kinked
C320C224K5R5TA7318
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
Through Hole
0.290" (7.36mm)
±10%
0.22 µF
-55°C ~ 125°C
Radial
-
50V
X7R
Bypass, Decoupling
-
GoldMax 300 Comm X7R
0.200" L x 0.125" W (5.08mm x 3.18mm)
-
0.100" (2.54mm)
Straight
C321C104K1R5CA
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
Through Hole
0.260" (6.60mm)
±10%
0.1 µF
-55°C ~ 125°C
Radial
-
100V
X7R
Bypass, Decoupling
-
GoldMax 300 Comm X7R
0.200" L x 0.125" W (5.08mm x 3.18mm)
-
0.250" (6.35mm)
Formed Leads
C333C474K5R5CA7317
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
Through Hole
0.400" (10.16mm)
±10%
0.47 µF
-55°C ~ 125°C
Radial
-
50V
X7R
Bypass, Decoupling
-
GoldMax 300 Comm X7R
0.280" L x 0.160" W (7.11mm x 4.07mm)
-
0.200" (5.08mm)
Formed Leads - Kinked
C330C334K5R5CA7303
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
Through Hole
0.360" (9.14mm)
±10%
0.33 µF
-55°C ~ 125°C
Radial
-
50V
X7R
Bypass, Decoupling
-
GoldMax 300 Comm X7R
0.280" L x 0.160" W (7.11mm x 4.07mm)
-
0.200" (5.08mm)
Formed Leads
C333C474K5R5TA7318
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
Through Hole
0.400" (10.16mm)
±10%
0.47 µF
-55°C ~ 125°C
Radial
-
50V
X7R
Bypass, Decoupling
-
GoldMax 300 Comm X7R
0.280" L x 0.160" W (7.11mm x 4.07mm)
-
0.200" (5.08mm)
Formed Leads - Kinked
C330C474K5R5CA7301
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
Through Hole
0.360" (9.14mm)
±10%
0.47 µF
-55°C ~ 125°C
Radial
-
50V
X7R
Bypass, Decoupling
-
GoldMax 300 Comm X7R
0.280" L x 0.160" W (7.11mm x 4.07mm)
-
0.200" (5.08mm)
Formed Leads
C333C334M5R5CA7301
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
Through Hole
0.400" (10.16mm)
±20%
0.33 µF
-55°C ~ 125°C
Radial
-
50V
X7R
Bypass, Decoupling
-
GoldMax 300 Comm X7R
0.280" L x 0.160" W (7.11mm x 4.07mm)
-
0.200" (5.08mm)
Formed Leads - Kinked
C320C104M5R5CA7301
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
Through Hole
0.290" (7.36mm)
±20%
0.1 µF
-55°C ~ 125°C
Radial
-
50V
X7R
Bypass, Decoupling
-
GoldMax 300 Comm X7R
0.200" L x 0.125" W (5.08mm x 3.18mm)
-
0.100" (2.54mm)
Straight
C320C104K1R5CA7303
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
Through Hole
0.290" (7.36mm)
±10%
0.1 µF
-55°C ~ 125°C
Radial
-
100V
X7R
Bypass, Decoupling
-
GoldMax 300 Comm X7R
0.200" L x 0.125" W (5.08mm x 3.18mm)
-
0.100" (2.54mm)
Straight
C322C104K1R5TA7318
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
Through Hole
0.260" (6.60mm)
±10%
0.1 µF
-55°C ~ 125°C
Radial
-
100V
X7R
Bypass, Decoupling
-
GoldMax 300 Comm X7R
0.200" L x 0.125" W (5.08mm x 3.18mm)
-
0.200" (5.08mm)
Formed Leads
C320C104K1R5CA7301
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
Through Hole
0.290" (7.36mm)
±10%
0.1 µF
-55°C ~ 125°C
Radial
-
100V
X7R
Bypass, Decoupling
-
GoldMax 300 Comm X7R
0.200" L x 0.125" W (5.08mm x 3.18mm)
-
0.100" (2.54mm)
Straight
C330C334M5R5CA
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
Through Hole
0.360" (9.14mm)
±20%
0.33 µF
-55°C ~ 125°C
Radial
-
50V
X7R
Bypass, Decoupling
-
GoldMax 300 Comm X7R
0.280" L x 0.160" W (7.11mm x 4.07mm)
-
0.200" (5.08mm)
Formed Leads
C320C104K5R5CA7305
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
Through Hole
0.290" (7.36mm)
±10%
0.1 µF
-55°C ~ 125°C
Radial
-
50V
X7R
Bypass, Decoupling
-
GoldMax 300 Comm X7R
0.200" L x 0.125" W (5.08mm x 3.18mm)
-
0.100" (2.54mm)
Straight
C322C104K5R5CA7301
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
Through Hole
0.260" (6.60mm)
±10%
0.1 µF
-55°C ~ 125°C
Radial
-
50V
X7R
Bypass, Decoupling
-
GoldMax 300 Comm X7R
0.200" L x 0.125" W (5.08mm x 3.18mm)
-
0.200" (5.08mm)
Formed Leads
C320C104K5R5CA7303
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
Through Hole
0.290" (7.36mm)
±10%
0.1 µF
-55°C ~ 125°C
Radial
-
50V
X7R
Bypass, Decoupling
-
GoldMax 300 Comm X7R
0.200" L x 0.125" W (5.08mm x 3.18mm)
-
0.100" (2.54mm)
Straight
C333C334M5R5TA7318
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
Through Hole
0.400" (10.16mm)
±20%
0.33 µF
-55°C ~ 125°C
Radial
-
50V
X7R
Bypass, Decoupling
-
GoldMax 300 Comm X7R
0.280" L x 0.160" W (7.11mm x 4.07mm)
-
0.200" (5.08mm)
Formed Leads - Kinked

关于  陶瓷电容器

电容器是必不可少的被动电子元件,具有存储电荷的能力。其中陶瓷电容器是利用陶瓷材料作为介质、金属层作为非极化电极构建而成。 陶瓷电容器在各种应用中得到广泛使用,包括汽车电子、旁路、解耦、滤波、射频(RF)电路和静电放电(ESD)保护等。它们因其小巧的尺寸、高电容值和在广泛频率范围内的优异性能而备受赞赏。 陶瓷电容器的插入式版本通常采用圆盘形或“块状”形状,并配有两根导线引脚,便于插入电路板。这种形式因方便焊接和牢固的机械连接而受到青睐。 陶瓷电容器具有许多优点,包括高可靠性、低成本以及在不同环境条件下的稳定性。这些电容器中使用的介质材料决定了其温度系数和电压特性。制造商通常会提供数据手册,指定电容值、电压等级、公差和其他重要参数,以帮助正确选择和应用。 总之,陶瓷电容器在电子领域被广泛用于汽车应用、信号滤波和ESD保护等各种用途。它们由陶瓷和金属交替层构成,插入式版本具有圆盘形或块状形状,并配有两根导线引脚,便于集成到电路板中。这些电容器表现出优异的性能、小巧的尺寸和可靠性,因此在电子设计中备受青睐。