Border Cap® Series, 陶瓷电容器

结果:
45
Manufacturer
Series
Capacitance
Temperature Coefficient
Size / Dimension
Tolerance
Voltage - Rated
Features
Applications
Package / Case
Operating Temperature
Height - Seated (Max)
Lead Spacing
Mounting Type
Ratings
Thickness (Max)
Failure Rate
Lead Style
结果45
搜索条目:
Border Cap®
选择
图片产品详情单价可用性ECAD 模型Height - Seated (Max)ToleranceCapacitanceOperating TemperatureRatingsVoltage - RatedPackage / CaseSize / DimensionMounting TypeLead StyleFailure RateSeriesTemperature CoefficientFeaturesApplicationsThickness (Max)Lead Spacing
D10UX101M2BX
CAP CER 100PF 25V UX SMD
1+
¥27.6120
5+
¥26.0780
10+
¥24.5440
数量
2,500 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
-
±20%
100 pF
-55°C ~ 125°C
-
25V
Nonstandard SMD
0.010" L x 0.010" W (0.25mm x 0.25mm)
Surface Mount, SLCC
-
-
Border Cap®
UX
Bonding Mountable, Single Layer
RF, Microwave, High Frequency, Bypass, Decoupling
0.009" (0.22mm)
-
D30BJ101K1BX
CAP CER 100PF 100V BJ SMD
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±10%
100 pF
-55°C ~ 125°C
-
100V
Nonstandard SMD
0.030" L x 0.030" W (0.76mm x 0.76mm)
Surface Mount, SLCC
-
-
Border Cap®
BJ
Bonding Mountable
RF, Microwave, High Frequency, Bypass, Decoupling
0.009" (0.22mm)
-
D20BE150K5EX
CAP CER 15PF 50V 0202
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±10%
15 pF
-55°C ~ 125°C
-
50V
0202 (0505 Metric)
0.020" L x 0.020" W (0.51mm x 0.51mm)
Surface Mount, SLCC
-
-
Border Cap®
BE
Bonding Mountable
RF, Microwave, High Frequency, Bypass, Decoupling
0.009" (0.22mm)
-
D10BL9R1K1BX
CAP CER 9.1PF 100V BL SMD
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±10%
9.1 pF
-55°C ~ 125°C
-
100V
Nonstandard SMD
0.010" L x 0.010" W (0.25mm x 0.25mm)
Surface Mount, SLCC
-
-
Border Cap®
BL
Bonding Mountable
RF, Microwave, High Frequency, Bypass, Decoupling
0.009" (0.22mm)
-
D20BN820K1BX
CAP CER 82PF 100V BN 0202
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±10%
82 pF
-55°C ~ 125°C
-
100V
0202 (0505 Metric)
0.020" L x 0.020" W (0.51mm x 0.51mm)
Surface Mount, SLCC
-
-
Border Cap®
BN
Bonding Mountable
RF, Microwave, High Frequency, Bypass, Decoupling
0.009" (0.22mm)
-
D25BN101K1EX
CAP CER 100PF 100V BN SMD
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±10%
100 pF
-55°C ~ 125°C
-
100V
Nonstandard SMD
0.025" L x 0.025" W (0.64mm x 0.64mm)
Surface Mount, SLCC
-
-
Border Cap®
BN
Bonding Mountable
General Purpose
0.009" (0.22mm)
-
D20BJ470K1BX
CAP CER 47PF 100V BJ 0202
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±10%
47 pF
-55°C ~ 125°C
-
100V
0202 (0505 Metric)
0.020" L x 0.020" W (0.51mm x 0.51mm)
Surface Mount, SLCC
-
-
Border Cap®
BJ
Bonding Mountable
RF, Microwave, High Frequency, Bypass, Decoupling
0.009" (0.22mm)
-
D20BU101M5BX
CAP CER 100PF 50V 0202
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±20%
100 pF
-55°C ~ 125°C
-
50V
0202 (0505 Metric)
0.020" L x 0.020" W (0.51mm x 0.51mm)
Surface Mount, SLCC
-
-
Border Cap®
BU
Bonding Mountable
RF, Microwave, High Frequency, Bypass, Decoupling
0.009" (0.22mm)
-
D10NR0R6B5BX
CAP CER 0.6PF 50V SMD
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±0.1pF
0.6 pF
-55°C ~ 125°C
-
50V
Nonstandard SMD
0.010" L x 0.010" W (0.25mm x 0.25mm)
Surface Mount, SLCC
-
-
Border Cap®
NR
Bonding Mountable
RF, Microwave, High Frequency, Bypass, Decoupling
0.009" (0.22mm)
-
D15BV101K1BX
CAP CER 100PF 100V BV SMD
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±10%
100 pF
-55°C ~ 125°C
-
100V
Nonstandard SMD
0.015" L x 0.015" W (0.38mm x 0.38mm)
Surface Mount, SLCC
-
-
Border Cap®
BV
Bonding Mountable
RF, Microwave, High Frequency, Bypass, Decoupling
0.009" (0.22mm)
-
D12BL100K1EX
CAP CER 10PF 100V BL SMD
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±10%
10 pF
-55°C ~ 125°C
-
100V
Nonstandard SMD
0.012" L x 0.012" W (0.31mm x 0.31mm)
Surface Mount, SLCC
-
-
Border Cap®
BL
Bonding Mountable
RF, Microwave, High Frequency, Bypass, Decoupling
0.009" (0.22mm)
-
D12BV101K1BX
CAP CER 100PF 100V BV SMD
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±10%
100 pF
-55°C ~ 125°C
-
100V
Nonstandard SMD
0.012" L x 0.012" W (0.31mm x 0.31mm)
Surface Mount, SLCC
-
-
Border Cap®
BV
Bonding Mountable, Single Layer
RF, Microwave, High Frequency, Bypass, Decoupling
0.009" (0.22mm)
-
D20BD100M1BX
CAP CER 10PF 100V BD SMD
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±20%
10 pF
-55°C ~ 125°C
-
100V
0202 (0505 Metric)
0.020" L x 0.020" W (0.51mm x 0.51mm)
Surface Mount, SLCC
-
-
Border Cap®
BD
Bonding Mountable, Single Layer
RF, Microwave, High Frequency, Bypass, Decoupling
0.009" (0.22mm)
-
D30UX102MCBX
CAP CER 1000PF 16V UX SMD
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±20%
1000 pF
-55°C ~ 125°C
-
16V
Nonstandard SMD
0.030" L x 0.030" W (0.76mm x 0.76mm)
Surface Mount, SLCC
-
-
Border Cap®
UX
Bonding Mountable, Single Layer
RF, Microwave, High Frequency, Bypass, Decoupling
0.009" (0.22mm)
-
D30BJ101M1BX
CAP CER 100PF 100V BJ SMD
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±20%
100 pF
-55°C ~ 125°C
-
100V
Nonstandard SMD
0.030" L x 0.030" W (0.76mm x 0.76mm)
Surface Mount, SLCC
-
-
Border Cap®
BJ
Bonding Mountable, Single Layer
RF, Microwave, High Frequency, Bypass, Decoupling
0.009" (0.22mm)
-
D30NS100M1BX
CAP CER 10PF 100V NS SMD
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±20%
10 pF
-55°C ~ 125°C
-
100V
Nonstandard SMD
0.030" L x 0.030" W (0.76mm x 0.76mm)
Surface Mount, SLCC
-
-
Border Cap®
NS
Bonding Mountable, Single Layer
RF, Microwave, High Frequency, Bypass, Decoupling
0.009" (0.22mm)
-
D10BL100M1BX
CAP CER 10PF 100V BL SMD
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±20%
10 pF
-55°C ~ 125°C
-
100V
Nonstandard SMD
0.010" L x 0.010" W (0.25mm x 0.25mm)
Surface Mount, SLCC
-
-
Border Cap®
BL
Bonding Mountable, Single Layer
RF, Microwave, High Frequency, Bypass, Decoupling
0.009" (0.22mm)
-
D25BN101M1BX
CAP CER 100PF 100V BN SMD
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±20%
100 pF
-55°C ~ 125°C
-
100V
Nonstandard SMD
0.025" L x 0.025" W (0.64mm x 0.64mm)
Surface Mount, SLCC
-
-
Border Cap®
BN
Bonding Mountable, Single Layer
RF, Microwave, High Frequency, Bypass, Decoupling
0.009" (0.22mm)
-
D25BJ101K1BX
CAP CER 100PF 100V BG SMD
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±10%
100 pF
-55°C ~ 125°C
-
100V
Nonstandard SMD
0.025" L x 0.025" W (0.64mm x 0.64mm)
Surface Mount, SLCC
-
-
Border Cap®
BG
Bonding Mountable, Single Layer
RF, Microwave, High Frequency, Bypass, Decoupling
0.009" (0.22mm)
-
D25BD100M1BX
CAP CER 10PF 100V BD SMD
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±20%
10 pF
-55°C ~ 125°C
-
100V
Nonstandard SMD
0.025" L x 0.025" W (0.64mm x 0.64mm)
Surface Mount, SLCC
-
-
Border Cap®
BD
Bonding Mountable, Single Layer
RF, Microwave, High Frequency, Bypass, Decoupling
0.009" (0.22mm)
-

关于  陶瓷电容器

电容器是必不可少的被动电子元件,具有存储电荷的能力。其中陶瓷电容器是利用陶瓷材料作为介质、金属层作为非极化电极构建而成。 陶瓷电容器在各种应用中得到广泛使用,包括汽车电子、旁路、解耦、滤波、射频(RF)电路和静电放电(ESD)保护等。它们因其小巧的尺寸、高电容值和在广泛频率范围内的优异性能而备受赞赏。 陶瓷电容器的插入式版本通常采用圆盘形或“块状”形状,并配有两根导线引脚,便于插入电路板。这种形式因方便焊接和牢固的机械连接而受到青睐。 陶瓷电容器具有许多优点,包括高可靠性、低成本以及在不同环境条件下的稳定性。这些电容器中使用的介质材料决定了其温度系数和电压特性。制造商通常会提供数据手册,指定电容值、电压等级、公差和其他重要参数,以帮助正确选择和应用。 总之,陶瓷电容器在电子领域被广泛用于汽车应用、信号滤波和ESD保护等各种用途。它们由陶瓷和金属交替层构成,插入式版本具有圆盘形或块状形状,并配有两根导线引脚,便于集成到电路板中。这些电容器表现出优异的性能、小巧的尺寸和可靠性,因此在电子设计中备受青睐。