X2Y® Polyterm® Series, 陶瓷电容器

结果:
9
Manufacturer
Series
Capacitance
Voltage - Rated
Size / Dimension
Package / Case
Thickness (Max)
Applications
Temperature Coefficient
Features
Operating Temperature
Height - Seated (Max)
Tolerance
Lead Spacing
Mounting Type
Ratings
Failure Rate
Lead Style
结果9
搜索条目:
X2Y® Polyterm®
选择
图片产品详情单价可用性ECAD 模型Height - Seated (Max)ToleranceOperating TemperatureRatingsCapacitanceVoltage - RatedTemperature CoefficientPackage / CaseMounting TypeSeriesApplicationsFeaturesLead StyleFailure RateSize / DimensionThickness (Max)Lead Spacing
101X43W474MF4E
CAP CER 0.47UF 100V X7R 1812
联系我们
数量
1 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
-
±20%
-55°C ~ 125°C
-
0.47 µF
100V
X7R
1812 (4532 Metric)
Surface Mount, MLCC
X2Y® Polyterm®
Bypass, Decoupling, Boardflex Sensitive
Low ESL (X2Y), Soft Termination
-
-
0.174" L x 0.125" W (4.42mm x 3.18mm)
0.090" (2.29mm)
-
101X44W404MF4E
CAP CER 0.4UF 100V X7R 1410
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±20%
-55°C ~ 125°C
-
0.4 µF
100V
X7R
1410 (3524 Metric)
Surface Mount, MLCC
X2Y® Polyterm®
Bypass, Decoupling, Boardflex Sensitive
Low ESL (X2Y), Soft Termination
-
-
0.140" L x 0.098" W (3.56mm x 2.49mm)
0.070" (1.78mm)
-
501X43W393MF4E
CAP CER 0.039UF 500V X7R 1812
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±20%
-55°C ~ 125°C
-
0.039 µF
500V
X7R
1812 (4532 Metric)
Surface Mount, MLCC
X2Y® Polyterm®
Bypass, Decoupling, Boardflex Sensitive
Low ESL (X2Y), Soft Termination
-
-
0.174" L x 0.125" W (4.42mm x 3.18mm)
0.090" (2.29mm)
-
501X44W153MF4E
CAP CER 0.015UF 500V X7R 1410
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±20%
-55°C ~ 125°C
-
0.015 µF
500V
X7R
1410 (3524 Metric)
Surface Mount, MLCC
X2Y® Polyterm®
Bypass, Decoupling, Boardflex Sensitive
Low ESL (X2Y), Soft Termination
-
-
0.140" L x 0.098" W (3.56mm x 2.49mm)
0.070" (1.78mm)
-
EMCT500G331M1GF001B
CAP CER 330PF 50V 20% NP0 0805
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±20%
-55°C ~ 125°C
-
330 pF
50V
C0G, NP0
0805 (2012 Metric)
Surface Mount, MLCC
X2Y® Polyterm®
Bypass, Decoupling
Low ESL (X2Y)
-
-
0.080" L x 0.050" W (2.03mm x 1.27mm)
0.040" (1.02mm)
-
EMDK501W153M1GF001E
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±20%
-55°C ~ 125°C
-
0.015 µF
500V
X7R
1410 (3524 Metric)
Surface Mount, MLCC
X2Y® Polyterm®
Bypass, Decoupling, Boardflex Sensitive
Low ESL (X2Y), Soft Termination
-
-
0.140" L x 0.098" W (3.56mm x 2.49mm)
0.070" (1.78mm)
-
EMDR101W474M1GF001E
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±20%
-55°C ~ 125°C
-
0.47 µF
100V
X7R
1812 (4532 Metric)
Surface Mount, MLCC
X2Y® Polyterm®
Bypass, Decoupling, Boardflex Sensitive
Low ESL (X2Y), Soft Termination
-
-
0.174" L x 0.125" W (4.42mm x 3.18mm)
0.090" (2.29mm)
-
EMDR501W393M1GF001E
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±20%
-55°C ~ 125°C
-
0.039 µF
500V
X7R
1812 (4532 Metric)
Surface Mount, MLCC
X2Y® Polyterm®
Bypass, Decoupling, Boardflex Sensitive
Low ESL (X2Y), Soft Termination
-
-
0.174" L x 0.125" W (4.42mm x 3.18mm)
0.090" (2.29mm)
-
EMDK101W404M1GF001E
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±20%
-55°C ~ 125°C
-
0.4 µF
100V
X7R
1410 (3524 Metric)
Surface Mount, MLCC
X2Y® Polyterm®
Bypass, Decoupling, Boardflex Sensitive
Low ESL (X2Y), Soft Termination
-
-
0.140" L x 0.098" W (3.56mm x 2.49mm)
0.070" (1.78mm)
-

关于  陶瓷电容器

电容器是必不可少的被动电子元件,具有存储电荷的能力。其中陶瓷电容器是利用陶瓷材料作为介质、金属层作为非极化电极构建而成。 陶瓷电容器在各种应用中得到广泛使用,包括汽车电子、旁路、解耦、滤波、射频(RF)电路和静电放电(ESD)保护等。它们因其小巧的尺寸、高电容值和在广泛频率范围内的优异性能而备受赞赏。 陶瓷电容器的插入式版本通常采用圆盘形或“块状”形状,并配有两根导线引脚,便于插入电路板。这种形式因方便焊接和牢固的机械连接而受到青睐。 陶瓷电容器具有许多优点,包括高可靠性、低成本以及在不同环境条件下的稳定性。这些电容器中使用的介质材料决定了其温度系数和电压特性。制造商通常会提供数据手册,指定电容值、电压等级、公差和其他重要参数,以帮助正确选择和应用。 总之,陶瓷电容器在电子领域被广泛用于汽车应用、信号滤波和ESD保护等各种用途。它们由陶瓷和金属交替层构成,插入式版本具有圆盘形或块状形状,并配有两根导线引脚,便于集成到电路板中。这些电容器表现出优异的性能、小巧的尺寸和可靠性,因此在电子设计中备受青睐。