YTW Series, 板间隔柱,堆叠器(板对板)

结果:
474
Manufacturer
Series
Length - Post (Mating)
Length - Stack Height
Number of Positions
Length - Tail
Length - Overall Pin
Number of Rows
Contact Finish Thickness - Post (Mating)
Contact Finish - Post (Mating)
Color
Termination
Row Spacing
Mounting Type
Pitch
结果474
搜索条目:
YTW
选择
图片产品详情单价可用性ECAD 模型Mounting TypeTerminationNumber of RowsColorNumber of PositionsPitchRow SpacingSeriesLength - Overall PinLength - Post (Mating)Length - Stack HeightLength - TailContact Finish - Post (Mating)Contact Finish Thickness - Post (Mating)
YTW-20-10-L-Q-350-070
2.00 MM FLEXYZ HIGH-DENSITY BOAR
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Through Hole
Solder
4
Black
80
0.079" (2.00mm)
0.079" (2.00mm)
YTW
0.614" (15.600mm)
0.194" (4.928mm)
0.350" (8.900mm)
0.070" (1.778mm)
Gold
10.0µin (0.25µm)
YTW-20-07-G-5-400-105
2.00 MM FLEXYZ HIGH-DENSITY BOAR
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Through Hole
Solder
5
Black
100
0.079" (2.00mm)
0.079" (2.00mm)
YTW
0.751" (19.075mm)
0.246" (6.248mm)
0.400" (10.160mm)
0.105" (2.667mm)
Gold
20.0µin (0.51µm)
YTW-18-07-L-6-470-100
2.00 MM FLEXYZ HIGH-DENSITY BOAR
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Through Hole
Solder
6
Black
108
0.079" (2.00mm)
0.079" (2.00mm)
YTW
0.751" (19.075mm)
0.181" (4.600mm)
0.470" (11.938mm)
0.100" (2.540mm)
Gold
10.0µin (0.25µm)
YTW-18-05-L-6-310-100
2.00 MM FLEXYZ HIGH-DENSITY BOAR
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Through Hole
Solder
6
Black
108
0.079" (2.00mm)
0.079" (2.00mm)
YTW
0.594" (15.088mm)
0.184" (4.674mm)
0.310" (7.874mm)
0.100" (2.540mm)
Gold
10.0µin (0.25µm)
YTW-23-06-L-Q-375-110
2.00 MM FLEXYZ HIGH-DENSITY BOAR
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Through Hole
Solder
4
Black
92
0.079" (2.00mm)
0.079" (2.00mm)
YTW
0.673" (17.100mm)
0.188" (4.775mm)
0.375" (9.525mm)
0.110" (2.794mm)
Gold
10.0µin (0.25µm)
YTW-20-03-G-Q-240-150
2.00 MM FLEXYZ HIGH-DENSITY BOAR
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Through Hole
Solder
4
Black
80
0.079" (2.00mm)
0.079" (2.00mm)
YTW
0.535" (13.589mm)
0.145" (3.683mm)
0.240" (6.096mm)
0.150" (3.810mm)
Gold
20.0µin (0.51µm)
YTW-20-03-G-Q-250-180
2.00 MM FLEXYZ HIGH-DENSITY BOAR
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Through Hole
Solder
4
Black
80
0.079" (2.00mm)
0.079" (2.00mm)
YTW
0.535" (13.589mm)
0.105" (2.667mm)
0.250" (6.350mm)
0.180" (4.572mm)
Gold
20.0µin (0.51µm)
YTW-33-06-T-5-460-090
2.00 MM FLEXYZ HIGH-DENSITY BOAR
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Through Hole
Solder
5
Black
165
0.079" (2.00mm)
0.079" (2.00mm)
YTW
0.673" (17.100mm)
0.123" (3.124mm)
0.460" (11.684mm)
0.090" (2.286mm)
Tin
-
YTW-25-02-L-Q-150-110
2.00 MM FLEXYZ HIGH-DENSITY BOAR
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Through Hole
Solder
4
Black
100
0.079" (2.00mm)
0.079" (2.00mm)
YTW
0.378" (9.600mm)
0.118" (2.997mm)
0.150" (3.810mm)
0.110" (2.794mm)
Gold
10.0µin (0.25µm)
YTW-25-01-L-Q-150-090
2.00 MM FLEXYZ HIGH-DENSITY BOAR
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Through Hole
Solder
4
Black
100
0.079" (2.00mm)
0.079" (2.00mm)
YTW
0.323" (8.204mm)
0.083" (2.108mm)
0.150" (3.810mm)
0.090" (2.286mm)
Gold
10.0µin (0.25µm)
YTW-40-07-L-Q-415-150
2.00 MM FLEXYZ HIGH-DENSITY BOAR
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Through Hole
Solder
4
Black
160
0.079" (2.00mm)
0.079" (2.00mm)
YTW
0.751" (19.075mm)
0.186" (4.724mm)
0.415" (10.541mm)
0.150" (3.810mm)
Gold
10.0µin (0.25µm)
YTW-15-06-L-5-475-090-038
2.00 MM FLEXYZ HIGH-DENSITY BOAR
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Through Hole
Solder
5
Black
75
0.079" (2.00mm)
0.079" (2.00mm)
YTW
0.673" (17.100mm)
0.108" (2.743mm)
0.475" (12.065mm)
0.090" (2.286mm)
Gold
10.0µin (0.25µm)
YTW-11-07-S-Q-300-200
2.00 MM FLEXYZ HIGH-DENSITY BOAR
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Through Hole
Solder
4
Black
44
0.079" (2.00mm)
0.079" (2.00mm)
YTW
0.751" (19.075mm)
0.251" (6.375mm)
0.300" (7.620mm)
0.200" (5.080mm)
Gold
30.0µin (0.76µm)
YTW-15-04-G-Q-262-125
2.00 MM FLEXYZ HIGH-DENSITY BOAR
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Through Hole
Solder
4
Black
60
0.079" (2.00mm)
0.079" (2.00mm)
YTW
0.555" (14.097mm)
0.168" (4.267mm)
0.262" (6.655mm)
0.125" (3.175mm)
Gold
20.0µin (0.51µm)
YTW-15-07-L-Q-475-150
2.00 MM FLEXYZ HIGH-DENSITY BOAR
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Through Hole
Solder
4
Black
60
0.079" (2.00mm)
0.079" (2.00mm)
YTW
0.751" (19.075mm)
0.126" (3.200mm)
0.475" (12.065mm)
0.150" (3.810mm)
Gold
10.0µin (0.25µm)
YTW-12-05-G-Q-400-090
2.00 MM FLEXYZ HIGH-DENSITY BOAR
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Through Hole
Solder
4
Black
48
0.079" (2.00mm)
0.079" (2.00mm)
YTW
0.594" (15.088mm)
0.104" (2.650mm)
0.400" (10.160mm)
0.090" (2.286mm)
Gold
20.0µin (0.51µm)
YTW-12-07-L-Q-505-150-022
2.00 MM FLEXYZ HIGH-DENSITY BOAR
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Through Hole
Solder
4
Black
48
0.079" (2.00mm)
0.079" (2.00mm)
YTW
0.751" (19.075mm)
0.096" (2.450mm)
0.505" (12.827mm)
0.150" (3.810mm)
Gold
10.0µin (0.25µm)
YTW-20-07-T-Q-480-120
2.00 MM FLEXYZ HIGH-DENSITY BOAR
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Through Hole
Solder
4
Black
80
0.079" (2.00mm)
0.079" (2.00mm)
YTW
0.751" (19.075mm)
0.151" (3.835mm)
0.480" (12.192mm)
0.120" (3.050mm)
Tin
-
YTW-12-06-L-Q-400-100
2.00 MM FLEXYZ HIGH-DENSITY BOAR
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Through Hole
Solder
4
Black
48
0.079" (2.00mm)
0.079" (2.00mm)
YTW
0.673" (17.100mm)
0.173" (4.394mm)
0.400" (10.160mm)
0.100" (2.540mm)
Gold
10.0µin (0.25µm)
YTW-10-09-G-Q-150-080
2.00 MM FLEXYZ HIGH-DENSITY BOAR
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Through Hole
Solder
4
Black
40
0.079" (2.00mm)
0.079" (2.00mm)
YTW
0.456" (11.582mm)
0.226" (5.740mm)
0.150" (3.810mm)
0.080" (2.032mm)
Gold
20.0µin (0.51µm)

关于  板间隔柱,堆叠器(板对板)

矩形连接器是专门设计用于建立不同印刷电路板(PCB)之间的电路连接,确保电气隔离和适当的板间距。这些连接器的选择基于它们的间距、堆叠高度、位置数和行数。 间距是指连接器上相邻引脚或接触点中心之间的距离。它决定了头部和其配对连接器之间的兼容性和对齐。不同的应用可能需要不同的间距尺寸以适应特定的PCB设计和要求。 堆叠高度是指连接器顶部和底部表面之间的垂直距离。它对于在使用这些头部连接器连接PCB时保持适当的间隙非常关键。选择适当的堆叠高度确保组装的板安全适配并能达到最佳功能。 头部连接器有多种配置,具有不同数量的位置和行数。位置数指连接器上单个接触或引脚的总数。这决定了可以在PCB之间建立的电气连接数量。行数表示接点是否在连接器上单排或多排排列。 这些连接器通常焊接到PCB上,提供安全可靠的连接。它们可用于表面安装和穿孔式版本,允许在组装过程中灵活使用并与不同类型的PCB兼容。 关于镀层选项,头部连接器可带有金、锡或锡铅镀层。选择镀层材料基于成本、导电性和环境考虑等因素。金镀层具有出色的耐腐蚀性和可靠的电气性能。锡和锡铅镀层选项是更具成本效益的替代品,但可能需要采取额外措施来缓解潜在问题,例如锡须生长。 总之,矩形连接器在提供绝缘和适当的板间距的同时,在连接分离的PCB电路方面发挥着至关重要的作用。它们的选择取决于间距、堆叠高度、位置数和行数等因素。这些连接器焊接到PCB上,可用于表面安装和穿孔式版本,具有多种镀层选项,以适应不同的应用需求。