NPCAP™-PXD Series, 铝 - 聚合物电容器

结果:
10
Manufacturer
Series
Ripple Current @ High Frequency
Capacitance
ESR (Equivalent Series Resistance)
Surface Mount Land Size
Size / Dimension
Height - Seated (Max)
Voltage - Rated
Operating Temperature
Applications
Tolerance
Lead Spacing
Mounting Type
Ripple Current @ Low Frequency
Lifetime @ Temp.
Ratings
Type
Package / Case
Features
Impedance
结果10
搜索条目:
NPCAP™-PXD
选择
图片产品详情单价可用性ECAD 模型Mounting TypeFeaturesHeight - Seated (Max)ToleranceApplicationsOperating TemperatureImpedanceRatingsCapacitanceVoltage - RatedSize / DimensionLead SpacingSeriesTypeESR (Equivalent Series Resistance)Lifetime @ Temp.Ripple Current @ High FrequencySurface Mount Land SizePackage / CaseRipple Current @ Low Frequency
APXD100ARA331MJ80G
CAP ALUM POLY 330UF 20% 10V SMD
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Surface Mount
-
0.315" (8.00mm)
±20%
General Purpose
-55°C ~ 125°C
-
-
330 µF
10 V
0.394" Dia (10.00mm)
-
NPCAP™-PXD
Polymer
25mOhm
2000 Hrs @ 125°C
3.5 A @ 100 kHz
0.406" L x 0.406" W (10.30mm x 10.30mm)
Radial, Can - SMD
-
APXD6R3ARA471MJ80G
CAP ALUM POLY 470UF 20% 6.3V SMD
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Surface Mount
-
0.315" (8.00mm)
±20%
General Purpose
-55°C ~ 125°C
-
-
470 µF
6.3 V
0.394" Dia (10.00mm)
-
NPCAP™-PXD
Polymer
25mOhm
2000 Hrs @ 125°C
3.5 A @ 100 kHz
0.406" L x 0.406" W (10.30mm x 10.30mm)
Radial, Can - SMD
-
APXD6R3ARA221MH70G
CAP ALUM POLY 220UF 20% 6.3V SMD
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Surface Mount
-
0.276" (7.00mm)
±20%
General Purpose
-55°C ~ 125°C
-
-
220 µF
6.3 V
0.315" Dia (8.00mm)
-
NPCAP™-PXD
Polymer
30mOhm
2000 Hrs @ 125°C
3.02 A @ 100 kHz
0.327" L x 0.327" W (8.30mm x 8.30mm)
Radial, Can - SMD
-
APXD100ARA151MH70G
CAP ALUM POLY 150UF 20% 10V SMD
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Surface Mount
-
0.276" (7.00mm)
±20%
General Purpose
-55°C ~ 125°C
-
-
150 µF
10 V
0.315" Dia (8.00mm)
-
NPCAP™-PXD
Polymer
35mOhm
2000 Hrs @ 125°C
2.8 A @ 100 kHz
0.327" L x 0.327" W (8.30mm x 8.30mm)
Radial, Can - SMD
-
APXD100ARA470ME61G
CAP ALUM POLY 47UF 20% 10V SMD
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Surface Mount
-
0.240" (6.10mm)
±20%
General Purpose
-55°C ~ 125°C
-
-
47 µF
10 V
0.197" Dia (5.00mm)
-
NPCAP™-PXD
Polymer
50mOhm
2000 Hrs @ 125°C
1.27 A @ 100 kHz
0.209" L x 0.209" W (5.30mm x 5.30mm)
Radial, Can - SMD
-
APXD6R3ARA560ME61G
CAP ALUM POLY 56UF 20% 6.3V SMD
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Surface Mount
-
0.240" (6.10mm)
±20%
General Purpose
-55°C ~ 125°C
-
-
56 µF
6.3 V
0.197" Dia (5.00mm)
-
NPCAP™-PXD
Polymer
45mOhm
2000 Hrs @ 125°C
1.38 A @ 100 kHz
0.209" L x 0.209" W (5.30mm x 5.30mm)
Radial, Can - SMD
-
APXD2R5ARA121ME61G
CAP ALUM POLY 120UF 20% 2.5V SMD
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Surface Mount
-
0.240" (6.10mm)
±20%
General Purpose
-55°C ~ 125°C
-
-
120 µF
2.5 V
0.197" Dia (5.00mm)
-
NPCAP™-PXD
Polymer
40mOhm
2000 Hrs @ 125°C
1.45 A @ 100 kHz
0.209" L x 0.209" W (5.30mm x 5.30mm)
Radial, Can - SMD
-
APXD100ARA560MF61G
CAP ALUM POLY 56UF 20% 10V SMD
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Surface Mount
-
0.240" (6.10mm)
±20%
General Purpose
-55°C ~ 125°C
-
-
56 µF
10 V
0.248" Dia (6.30mm)
-
NPCAP™-PXD
Polymer
40mOhm
2000 Hrs @ 125°C
2.25 A @ 100 kHz
0.260" L x 0.260" W (6.60mm x 6.60mm)
Radial, Can - SMD
-
APXD6R3ARA101MF61G
CAP ALUM POLY 100UF 20% 6.3V SMD
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Surface Mount
-
0.240" (6.10mm)
±20%
General Purpose
-55°C ~ 125°C
-
-
100 µF
6.3 V
0.248" Dia (6.30mm)
-
NPCAP™-PXD
Polymer
35mOhm
2000 Hrs @ 125°C
2.4 A @ 100 kHz
0.260" L x 0.260" W (6.60mm x 6.60mm)
Radial, Can - SMD
-
APXD2R5ARA221MF61G
CAP ALUM POLY 220UF 20% 2.5V SMD
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Surface Mount
-
0.240" (6.10mm)
±20%
General Purpose
-55°C ~ 125°C
-
-
220 µF
2.5 V
0.248" Dia (6.30mm)
-
NPCAP™-PXD
Polymer
30mOhm
2000 Hrs @ 125°C
2.5 A @ 100 kHz
0.260" L x 0.260" W (6.60mm x 6.60mm)
Radial, Can - SMD
-

关于  铝 - 聚合物电容器

铝聚合物电容器是一种极化电容器,它利用铝电极材料和铝氧化物介质,类似于标准电解电容器。然而,与传统的电解电容器不同,它们采用了导电聚合物材料,而不是传统的液体电解质。 与标准铝电解电容器相比,聚合物电容器通常表现出增强的电气性能。但这种改进是以更高的成本和对工作环境更敏感为代价的。在某些应用中,聚合物电容器以其低等效串联电阻(ESR)、更高的纹波电流承受能力和更长的运行寿命等优势而著称。 尽管具有这些性能优势,但在这些电容器中使用导电聚合物材料导致它们的制造成本较高。此外,聚合物电容器对温度、电压和电流等因素更为敏感,需要仔细考虑工作条件,以确保其性能和可靠性达到最佳状态。 总之,与标准铝电解电容器相比,铝聚合物电容器具有改善的电特性,但其更高的成本和对环境因素更敏感,需要仔细评估其在特定应用中的适用性。