HZA_V Series, 铝 - 聚合物电容器

结果:
10
Manufacturer
Series
Capacitance
ESR (Equivalent Series Resistance)
Ripple Current @ Low Frequency
Ripple Current @ High Frequency
Voltage - Rated
Surface Mount Land Size
Size / Dimension
Operating Temperature
Applications
Height - Seated (Max)
Tolerance
Lead Spacing
Mounting Type
Ratings
Lifetime @ Temp.
Type
Package / Case
Features
Impedance
结果10
搜索条目:
HZA_V
选择
图片产品详情单价可用性ECAD 模型Mounting TypeFeaturesHeight - Seated (Max)TypeToleranceImpedanceOperating TemperatureRatingsCapacitanceSize / DimensionApplicationsLead SpacingSeriesVoltage - RatedESR (Equivalent Series Resistance)Lifetime @ Temp.Ripple Current @ Low FrequencyRipple Current @ High FrequencySurface Mount Land SizePackage / Case
HZA336M080G24VT-F
联系我们
数量
1 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
Surface Mount
-
0.413" (10.50mm)
Hybrid
±20%
-
-55°C ~ 105°C
AEC-Q200
33 µF
0.394" Dia (10.00mm)
Automotive, Bypass, Decoupling
-
HZA_V
80 V
36mOhm
10000 Hrs @ 105°C
170 mA @ 120 Hz
1.7 A @ 100 kHz
0.406" L x 0.406" W (10.30mm x 10.30mm)
Radial, Can - SMD
HZA227M025F24VT-F
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Surface Mount
-
0.413" (10.50mm)
Hybrid
±20%
-
-55°C ~ 105°C
AEC-Q200
220 µF
0.315" Dia (8.00mm)
Automotive, Bypass, Decoupling
-
HZA_V
25 V
27mOhm
10000 Hrs @ 105°C
230 mA @ 120 Hz
2.3 A @ 100 kHz
0.327" L x 0.327" W (8.30mm x 8.30mm)
Radial, Can - SMD
HZA686M050F24VT-F
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Surface Mount
-
0.413" (10.50mm)
Hybrid
±20%
-
-55°C ~ 105°C
AEC-Q200
68 µF
0.315" Dia (8.00mm)
Automotive, Bypass, Decoupling
-
HZA_V
50 V
30mOhm
10000 Hrs @ 105°C
180 mA @ 120 Hz
1.8 A @ 100 kHz
0.327" L x 0.327" W (8.30mm x 8.30mm)
Radial, Can - SMD
HZA277M035G24VT-F
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Surface Mount
-
0.413" (10.50mm)
Hybrid
±20%
-
-55°C ~ 105°C
AEC-Q200
270 µF
0.394" Dia (10.00mm)
Automotive, Bypass, Decoupling
-
HZA_V
35 V
20mOhm
10000 Hrs @ 105°C
250 mA @ 120 Hz
2.5 A @ 100 kHz
0.406" L x 0.406" W (10.30mm x 10.30mm)
Radial, Can - SMD
HZA107M050G24VT-F
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Surface Mount
-
0.413" (10.50mm)
Hybrid
±20%
-
-55°C ~ 105°C
AEC-Q200
100 µF
0.394" Dia (10.00mm)
Automotive, Bypass, Decoupling
-
HZA_V
50 V
28mOhm
10000 Hrs @ 105°C
200 mA @ 120 Hz
2 A @ 100 kHz
0.406" L x 0.406" W (10.30mm x 10.30mm)
Radial, Can - SMD
HZA157M035F24VT-F
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Surface Mount
-
0.413" (10.50mm)
Hybrid
±20%
-
-55°C ~ 105°C
AEC-Q200
150 µF
0.315" Dia (8.00mm)
Automotive, Bypass, Decoupling
-
HZA_V
35 V
27mOhm
10000 Hrs @ 105°C
230 mA @ 120 Hz
2.3 A @ 100 kHz
0.327" L x 0.327" W (8.30mm x 8.30mm)
Radial, Can - SMD
HZA337M025G24VT-F
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Surface Mount
-
0.413" (10.50mm)
Hybrid
±20%
-
-55°C ~ 105°C
AEC-Q200
330 µF
0.394" Dia (10.00mm)
Automotive, Bypass, Decoupling
-
HZA_V
25 V
20mOhm
10000 Hrs @ 105°C
250 mA @ 120 Hz
2.5 A @ 100 kHz
0.406" L x 0.406" W (10.30mm x 10.30mm)
Radial, Can - SMD
HZA226M080F24VT-F
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Surface Mount
-
0.413" (10.50mm)
Hybrid
±20%
-
-55°C ~ 105°C
AEC-Q200
22 µF
0.315" Dia (8.00mm)
Automotive, Bypass, Decoupling
-
HZA_V
80 V
45mOhm
10000 Hrs @ 105°C
155 mA @ 220 Hz
1.55 A @ 100 kHz
0.327" L x 0.327" W (8.30mm x 8.30mm)
Radial, Can - SMD
HZA566M063G24VT-F
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Surface Mount
-
0.413" (10.50mm)
Hybrid
±20%
-
-55°C ~ 105°C
AEC-Q200
56 µF
0.394" Dia (10.00mm)
Automotive, Bypass, Decoupling
-
HZA_V
63 V
30mOhm
10000 Hrs @ 105°C
180 mA @ 120 Hz
1.8 A @ 100 kHz
0.406" L x 0.406" W (10.30mm x 10.30mm)
Radial, Can - SMD
HZA336M063F24VT-F
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Surface Mount
-
0.413" (10.50mm)
Hybrid
±20%
-
-55°C ~ 105°C
AEC-Q200
33 µF
0.315" Dia (8.00mm)
Automotive, Bypass, Decoupling
-
HZA_V
63 V
40mOhm
10000 Hrs @ 105°C
170 mA @ 120 Hz
1.7 A @ 100 kHz
0.327" L x 0.327" W (8.30mm x 8.30mm)
Radial, Can - SMD

关于  铝 - 聚合物电容器

铝聚合物电容器是一种极化电容器,它利用铝电极材料和铝氧化物介质,类似于标准电解电容器。然而,与传统的电解电容器不同,它们采用了导电聚合物材料,而不是传统的液体电解质。 与标准铝电解电容器相比,聚合物电容器通常表现出增强的电气性能。但这种改进是以更高的成本和对工作环境更敏感为代价的。在某些应用中,聚合物电容器以其低等效串联电阻(ESR)、更高的纹波电流承受能力和更长的运行寿命等优势而著称。 尽管具有这些性能优势,但在这些电容器中使用导电聚合物材料导致它们的制造成本较高。此外,聚合物电容器对温度、电压和电流等因素更为敏感,需要仔细考虑工作条件,以确保其性能和可靠性达到最佳状态。 总之,与标准铝电解电容器相比,铝聚合物电容器具有改善的电特性,但其更高的成本和对环境因素更敏感,需要仔细评估其在特定应用中的适用性。