FPCAP, RPA Series, 铝 - 聚合物电容器

结果:
6
Manufacturer
Series
Capacitance
Ripple Current @ Low Frequency
ESR (Equivalent Series Resistance)
Ripple Current @ High Frequency
Voltage - Rated
Height - Seated (Max)
Surface Mount Land Size
Size / Dimension
Impedance
Operating Temperature
Applications
Tolerance
Lead Spacing
Mounting Type
Lifetime @ Temp.
Ratings
Type
Package / Case
Features
结果6
搜索条目:
FPCAP, RPA
选择
图片产品详情单价可用性ECAD 模型Mounting TypeFeaturesToleranceApplicationsImpedanceRatingsOperating TemperatureHeight - Seated (Max)Voltage - RatedCapacitanceLead SpacingSeriesTypeESR (Equivalent Series Resistance)Lifetime @ Temp.Ripple Current @ Low FrequencyRipple Current @ High FrequencySize / DimensionSurface Mount Land SizePackage / Case
RPA1C390MCN1GS
CAP ALUM POLY 39UF 20% 16V SMD
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Surface Mount
-
±20%
General Purpose
-
-
-55°C ~ 105°C
0.224" (5.70mm)
16 V
39 µF
-
FPCAP, RPA
Polymer
24mOhm
2000 Hrs @ 105°C
250 mA @ 120 Hz
2.5 A @ 100 kHz
0.248" Dia (6.30mm)
0.256" L x 0.256" W (6.50mm x 6.50mm)
Radial, Can - SMD
RPA1A331MCN1GS
CAP ALUM POLY 330UF 20% 10V SMD
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Surface Mount
-
±20%
General Purpose
-
-
-55°C ~ 105°C
0.315" (8.00mm)
10 V
330 µF
-
FPCAP, RPA
Polymer
20mOhm
2000 Hrs @ 105°C
360 mA @ 120 Hz
3.6 A @ 100 kHz
0.394" Dia (10.00mm)
0.406" L x 0.406" W (10.30mm x 10.30mm)
Radial, Can - SMD
RPA1C221MCN1GS
CAP ALUM POLY 220UF 20% 16V SMD
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Surface Mount
-
±20%
General Purpose
-
-
-55°C ~ 105°C
0.315" (8.00mm)
16 V
220 µF
-
FPCAP, RPA
Polymer
22mOhm
2000 Hrs @ 105°C
345 mA @ 120 Hz
3.45 A @ 100 kHz
0.394" Dia (10.00mm)
0.406" L x 0.406" W (10.30mm x 10.30mm)
Radial, Can - SMD
RPA1C181MCN1GS
CAP ALUM POLY 180UF 20% 16V SMD
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Surface Mount
-
±20%
General Purpose
-
-
-55°C ~ 105°C
0.315" (8.00mm)
16 V
180 µF
-
FPCAP, RPA
Polymer
20mOhm
2000 Hrs @ 105°C
360 mA @ 120 Hz
3.6 A @ 100 kHz
0.394" Dia (10.00mm)
0.406" L x 0.406" W (10.30mm x 10.30mm)
Radial, Can - SMD
RPA0J471MCN1GS
CAP ALUM POLY 470UF 20% 6.3V SMD
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Surface Mount
-
±20%
General Purpose
-
-
-55°C ~ 105°C
0.315" (8.00mm)
6.3 V
470 µF
-
FPCAP, RPA
Polymer
18mOhm
2000 Hrs @ 105°C
430 mA @ 120 Hz
4.3 A @ 100 kHz
0.394" Dia (10.00mm)
0.406" L x 0.406" W (10.30mm x 10.30mm)
Radial, Can - SMD
RPA0G561MCN1GS
CAP ALUM POLY 560UF 20% 4V SMD
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Surface Mount
-
±20%
General Purpose
-
-
-55°C ~ 105°C
0.461" (11.70mm)
4 V
560 µF
-
FPCAP, RPA
Polymer
9mOhm
2000 Hrs @ 105°C
540 mA @ 120 Hz
5.4 A @ 100 kHz
0.315" Dia (8.00mm)
0.327" L x 0.327" W (8.30mm x 8.30mm)
Radial, Can - SMD

关于  铝 - 聚合物电容器

铝聚合物电容器是一种极化电容器,它利用铝电极材料和铝氧化物介质,类似于标准电解电容器。然而,与传统的电解电容器不同,它们采用了导电聚合物材料,而不是传统的液体电解质。 与标准铝电解电容器相比,聚合物电容器通常表现出增强的电气性能。但这种改进是以更高的成本和对工作环境更敏感为代价的。在某些应用中,聚合物电容器以其低等效串联电阻(ESR)、更高的纹波电流承受能力和更长的运行寿命等优势而著称。 尽管具有这些性能优势,但在这些电容器中使用导电聚合物材料导致它们的制造成本较高。此外,聚合物电容器对温度、电压和电流等因素更为敏感,需要仔细考虑工作条件,以确保其性能和可靠性达到最佳状态。 总之,与标准铝电解电容器相比,铝聚合物电容器具有改善的电特性,但其更高的成本和对环境因素更敏感,需要仔细评估其在特定应用中的适用性。